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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/30/1996
Application #:
08376716
Filing Dt:
01/23/1995
Inventor:
HYUNSANG HWANG
Title:
METHOD OF FORMING A SILICON INSULATION LAYER IN A SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
007342/0413Recorded: 01/23/1995Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/19/1995
Assignee:
50 HYANGJEONG-DONG
CHEONGJU-SI, CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF
Correspondent:
ALAN R. LOUDERMILK
SUITE 16C
1550 N. LAKE SHORE DRIVE
CHICAGO, IL 60610

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