Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/07/1996
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Application #:
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08262113
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Filing Dt:
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06/17/1994
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Inventors:
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KIYOSHI MITANI, MASATAKE KATAYAMA
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Title:
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METHOD OF MAKING BONDED WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-2, MARUNOUCHI 1-CHOME CHIYODA-KU |
| TOKYO, JAPAN |
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| STEPHEN A. BECKER |
| LOWE, PRICE, LEBLANC & BECKER |
| 99 CANAL CENTER PLAZA, STE. 300 |
| ALEXANDRIA, VA 22314 |
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