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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/14/1996
Application #:
08370278
Filing Dt:
01/09/1995
Inventors:
RICHARD J. BERGERON, THOMAS J. LAMOTHE, JOSEPH E. SUAREZ, JOHN A. THOMPSON
Title:
ADDITIVE STRUCTURE AND METHOD FOR TESTING SEMICONDUCTOR WIRE BOND DIES
Assignment: 1
Reel/Frame:
007311/0437Recorded: 01/09/1995Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/09/1995
Exec Dt:
01/09/1995
Exec Dt:
01/09/1995
Exec Dt:
01/09/1995
Assignee:
OLD ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
HESLIN & ROTHENBERG, P.C.
KEVIN P. RADIGAN
5 COLUMBIA CIRCLE
ALBANY, NY 12203

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