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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/28/1996
Application #:
08270372
Filing Dt:
07/05/1994
Inventors:
SEIICHI OSHIMA, TATSUO OOTA
Title:
SEMICONDUCTOR POWER MODULE HAVING AN IMPROVED COMPOSITE BOARD AND METHOD OF FABRICATING THE SAME
Assignment: 1
Reel/Frame:
007136/0579Recorded: 09/02/1994Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/20/1994
Exec Dt:
06/15/1994
Assignee:
2-3, MARUNOUCHI 2-CHOME
CHIYODA-KU, TOKYO 100, JAPAN
Correspondent:
OBLON, SPIVAK, MCCLELLAND, ET AL.
ROBERT F. GNUSE
FOURTH FLOOR
1755 JEFFERSON DAVIS HIGHWAY
ARLINGTON, VA 22202
Assignment: 2
Reel/Frame:
008650/0409Recorded: 08/05/1997Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/22/1997
Assignee:
81 WYMAN STREET
WALTHAM, MASSACHUSETTS 02254
Correspondent:
THERMO ELECTRON CORP.
HERB MESSENGER
81 WYMAN STREET
WALTHAM, MA 02254

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