Patent Assignment Abstract of Title
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For pending or abandoned applications please consult USPTO staff.
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/28/1996
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Application #:
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08310330
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Filing Dt:
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09/22/1994
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Inventors:
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HIDENOBU GOCHI, TETSURO WASHIDA
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Title:
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SEMICONDUCTOR MODULE AND IC PACKAGE USED FOR THE SEMICONDUCTOR MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100 |
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| LEYDIG, VOIT & MAYER |
| JEFFREY A. WYAND |
| SUITE 300 |
| 700 THIRTEENTH STREET, N.W. |
| WASHINGTON, DC 20005 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT PREVIOUSLY RECORDED ON REEL 7243, FRAME 597, TO CORRECT THE NAME OF AN ASSIGNOR.
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| 2-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, |
| TOKYO 100, JAPAN |
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| JEFFREY A. WYAND |
| LEYDIG, VOIT & MAYER |
| SUITE 300 |
| 700 THIRTEENTH STREET, N.W. |
| WASHINGTON, DC 20005 |
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