Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/06/1996
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Application #:
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08448855
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Filing Dt:
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05/24/1995
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Inventor:
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REIKO SUMIDA
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Title:
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SEMICONDUCTOR CERAMIC PACKAGE WITH THERMAL VIAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| OMINE-CHO, MINE-SHI |
| 2701-1, AZA-IWAKURA, HIGASHIBUN |
| YAMAGUCHI, JAPAN 759-2 |
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| RICHARD L. SCHWAAB |
| FOLEY & LARDNER |
| 3000 K ST., NW |
| SUITE 500 |
| WASHINGTON, DC 20007-5109 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| OHMINE-CHO, MINE-SHI |
| 2701-1, AZA IWAKURA, HIGASHIBUN |
| YAMAGUCHI-PERFECTURE, JAPAN |
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| RICHARD L. SCHWAAB |
| PATENT DEPARTMENT |
| 3000 K STREET, SUITE 500 |
| WASHINGTON, D.C. 20007-5109 |
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