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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/27/1996
Application #:
08176700
Filing Dt:
01/03/1994
Inventor:
RICHARD BROSSART
Title:
PROCESS FOR BONDING A SEMICONDUCTOR DIE TO A VARIABLE DIE SIZE INNER LEAD LAYOUT
Assignment: 1
Reel/Frame:
022878/0982Recorded: 06/30/2009Pages: 7
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/06/2007
Assignee:
1621 BARBER LANE
MS: D-106
MILPITAS, CALIFORNIA 95035
Correspondent:
LSI CORPORATION
1621 BARBER LANE
MS: D-106
MILPITAS, CA 95035

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