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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/03/1996
Application #:
08170138
Filing Dt:
12/20/1993
Inventor:
JOHN MCCORMICK
Title:
SEMICONDUCTOR DEVICE ASSEMBLY INCLUDING POWER OR GROUND PLANE WHICH IS PROVIDED ON OPPOSITE SURFACE OF INSULATING LAYER FROM SIGNAL TRACES, AND IS EXPOSED TO CENTRAL OPENING IN INSULATING LAYER FOR INTERCONNECTION TO SEMICONDUCTOR DIE
Assignment: 1
Reel/Frame:
006828/0546Recorded: 12/20/1993Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/20/1993
Assignee:
1551 MCCARTHY BLVD.
MILPITAS, CALIFORNIA 95035
Correspondent:
BRETON A. BOCCHIERI
POMS, SMITH, LANDE & ROSE
2121 AVENUE OF THE STARS
#1400
LOS ANGELES, CA 90067-5010

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