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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/10/1996
Application #:
08171026
Filing Dt:
12/21/1993
Inventors:
SADAO HIRAE, HIDEAKI MATSUBARA, MOTOHIRO KOUNO, TAKAMASA SAKAI
Title:
NON-DESTRUCTIVE MEASURING SENSOR FOR SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
006820/0339Recorded: 12/21/1993Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/19/1993
Exec Dt:
11/22/1993
Exec Dt:
11/22/1993
Exec Dt:
11/19/1993
Assignee:
1-1, TENJINKITAMACHI, TERANOUCHI-AGARU, 4-CHOME, HORIKAWA-DORI
KAMIKYO-KU, KYOTO, JAPAN
Correspondent:
OSTROLENK, FABER, GERB & SOFFEN
STEVEN I. WEISBURD
1180 AVE. OF THE AMERICAS
NEW YORK, NY 10036-8403

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