Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/15/1996
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Application #:
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08013845
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Filing Dt:
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02/05/1993
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Inventors:
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TOSHIKAZU YOSHIMIZU, HIDEO AZUMAI
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Title:
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BASE SUBSTRATE OF MULTICHIP MODULE AND METHOD FOR INSPECTING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST.
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| ESAKA SOLITON BLDG. 12-38, ESAKA-CHO 1-CHOME, SUITA-SHI |
| OSAKA, JAPAN |
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| LOWE, PRICE, LEBLANC & BECKER |
| GENE Z. RUBINSON |
| 99 CANAL CENTER PLAZA |
| SUITE 300 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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| 4-5-36, MIYAHAA, YODOGAWA-KU |
| OSAKA 532, JAPAN |
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| LOWE, PRICE, LEBLANC & BECKER |
| STEPHEN A. BECKER |
| 99 CANAL CENTER PLAZA, SUITE 300 |
| ALEXANDRIA, VA 22314 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 4-1-6 MIYAHARA, YODOGAWA-KU |
| OSAKA 532-0003, JAPAN |
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| MCDERMOTT, WILL & EMERY |
| STEPHEN A. BECKER |
| 600 13TH STREET NW |
| WASHINGTON, D.C. 20005 |
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