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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/22/1996
Application #:
08489983
Filing Dt:
06/12/1995
Inventors:
ARMAND R. TANGUAY JR., B. KEITH JENKINS
Title:
MODULATOR-BASED PHOTONIC CHIP-TO-CHIP INTERCONNECTIONS FOR DENSE THREE-DIMENSIONAL MULTICHIP MODULE INTEGRATION
Assignment: 1
Reel/Frame:
008039/0985Recorded: 07/18/1996Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/16/1996
Exec Dt:
07/16/1996
Assignee:
UNIVERSITY PARK
3716 SOUTH HOPE STREET SUITE 313
LOSA ANGELES, CALIFORNIA 90007
Correspondent:
BENMAN COLLINS & SAWYER
DAVID W. COLLINS
711 WEST LOS ALTOS ROAD
TUCSON AZ 85704

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