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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
11/05/1996
Application #:
08383511
Filing Dt:
02/06/1995
Inventor:
RICHARD J. ROSS
Title:
INTEGRATED CIRCUIT PACKAGES WITH HEAT DISSIPATION FOR HIGH CURRENT LOAD
Assignment: 1
Reel/Frame:
007374/0602Recorded: 03/13/1995Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/13/1995
Assignee:
7750 EDGEWATER DRIVE OAKLAND, CA 94621
OAKLAND,, CALIFORNIA
Correspondent:
TOWNSEND AND TOWNSEND KHOURIE AND CREW
M. HENRY HEINES
20TH FLOOR, STEUART STREET TOWER
ONE MARKET PLAZA
SAN FRANCISCO, CA 94105-1492
Assignment: 2
Reel/Frame:
029238/0279Recorded: 11/05/2012Pages: 10
Conveyance:
SECURITY AGREEMENT
Assignor:
Exec Dt:
10/18/2012
Assignee:
380 INTERLOCKEN CRESCENT, SUITE 600
BROOMFIELD, COLORADO 80021
Correspondent:
BENJAMIN C. WILES
TROUTMAN SANDERS LLP
600 PEACHTREE STREET NE, SUITE 5200
ATLANTA, GA 30308

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