Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/19/1996
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Application #:
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08241192
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Filing Dt:
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05/11/1994
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Inventors:
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ROBERT F. FOSTER, BRIAN SHEKERJIAN, JOSEPH T. HILLMAN
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Title:
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THERMAL CYCLE RESISTANT SEAL AND METHOD OF SEALING FOR USE WITH SEMICONDUCTOR WAFER PROCESSING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ORANGEBURG, NEW YORK 10962 |
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| WAYNE L. JACOBS, ESQ. |
| WOOD, HERRON & EVANS |
| 2700 CAREW TOWER |
| CINCINNATI, OH 45202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-CHOME, SHINAGAWA-KU |
| 7-35 KITASHINAGAWA |
| TOKYO, JAPAN |
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| WOOD, HERRON & EVANS |
| WAYNE L. JACOBS |
| 2700 CAREW TOWER |
| CINCINNATI, OH 45202 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TBS BROADCASTING CENTER, 3-6 AKASAKA 5-CHOME |
| MINATO-KU, TOKYO 107, JAPAN |
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| WOOD, HERRON & EVANS, L.L.P. |
| JOSEPH R. JORDAN, ESQ. |
| 2700 CAREW TOWER |
| CINCINNATI, OH 45202 |
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