Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/03/1996
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Application #:
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08523392
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Filing Dt:
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09/05/1995
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Inventors:
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HIROSHI NAKAMURA, KENTARO TOMIOKA, KIYOUMI NINOMIYA, HIDEKI OGAWA, YUJI NAKAJIMA
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Title:
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STRUCTURE FOR COOLING A CIRCUIT MODULE HAVING A CIRCUIT BOARD AND A HEAT-GENERATING IC CHIP MOUNTED ON THE BOARD, AND PORTABLE ELECTRONIC APPARATUS INCORPORATING THE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 72 HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, JAPAN |
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| CUSHMAN, DARBY & CUSHMAN |
| DALE S. LAZAR |
| 1100 NEW YORK AVENUE, N.W., 9TH FL. |
| WASHINGTON, DC 20005-3918 |
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