Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/10/1996
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Application #:
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08602200
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Filing Dt:
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02/16/1996
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Inventors:
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PAUL R. BESSER, RAYMOND LEE, KHANH TRAN
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Title:
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PROCESS FOR DEPOSITION OF A TI/TIN CAP LAYER ON ALUMINUM METALLIZATION AND APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ONE AMD PLACE |
SUNNYVALE, CALIFORNIA 94088 |
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SKJERVEN, MORRILL, MACPHERSON ET AL |
PAUL J. WINTERS |
25 METRO DR., SUITE 700 |
SAN JOSE, CA 95110 |
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