Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/10/1996
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Application #:
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08368847
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Filing Dt:
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01/05/1995
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Inventors:
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KWANG-LUNG LIN, CHWAN-YING LEE
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Title:
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METHOD FOR PRODUCING ELECTROLESS BARRIER LAYER AND SOLDER BUMP ON CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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HO-PING E. RD. |
FL. 18, NO. 106, SEC. 2 |
TAIPEI, TAIWAN R.O.C. |
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EVAN R. WITT |
MADSON & METCALF |
950 FIRST INTERSTATE PLAZA |
170 SO. MAIN STREET |
SALT LAKE CITY, UTAH 84101 |
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