Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
12/10/1996
|
Application #:
|
08306024
|
Filing Dt:
|
09/14/1994
|
|
Inventors:
|
JERROLD L. KING, J. MIKE BROOKS, WALTER L. MODEN
|
|
Title:
|
ADHESION ENHANCED SEMICONDUCTOR DIE FOR MOLD COMPOUND PACKAGING
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2805 E. COLUMBIA RD. BOISE, ID 83706 |
|
|
|
|
| HOPKINS, RODEN, CROCKETT, HANSEN & |
| HOOPES |
| LANE R. SIMMONS |
| 428 PARK AVE., P.O. BOX 51219 |
| IDAHO FALLS, ID 83405-1219 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
MERGER (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2805 E. COLUMBIA RD. |
| LEGAL DEPT., MS 507 |
| BOISE, IDAHO 83706-9698 |
|
|
|
|
| LANE R. SIMMONS |
| HOPKINS, RODEN, CROCKETT, ET AL. |
| 428 PARK AVE. |
| P.O. BOX 51219 |
| IDAHO FALLS, ID 83405-1219 |
|
|
Search Results as of:
05/14/2024 02:02 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
