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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/31/1996
Application #:
08418977
Filing Dt:
04/07/1995
Inventors:
YOSHITAMI YAMAMURA, NOBUHIKO MORIMOTO, NOBUYUKI TANAKA
Title:
POLYMERIZABLE, CURABLE MOLDING COMPOSITION AND A MOLDING OR COATING PROCESS USING THIS MOLDING COMPOSITION
Assignment: 1
Reel/Frame:
007542/0891Recorded: 06/12/1995Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/22/1995
Exec Dt:
05/19/1995
Exec Dt:
05/22/1995
Assignee:
TFP/PATENTABTEILUNG
DUSSELDORF, GERMANY D-401
Correspondent:
JOHN DANIEL WOOD
HENKEL CORPORATION
LAW DEPARTMENT
140 GERMANTOWN PIKE - SUITE 150
PLYMOUTH MTG., PA 19462

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