Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/04/1997
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Application #:
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08534316
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Filing Dt:
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09/27/1995
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Inventor:
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KATSUNOBU SUZUKI
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Title:
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PACKAGE FOR PACKAGING A SEMICONDUCTOR DEVICE SUITABLE FOR BEING CONNECTED TO A CONNECTION OBJECT BY SOLDERING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| SUGHRUE, MION, ZINN, MACPEAK & SEAS |
| J. FRANK OSHA |
| 2100 PENNSYLVANIA AVE., NW |
| SUITE 800 |
| WASHINGTON, DC 20037-3202 |
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