Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/11/1997
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Application #:
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08421708
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Filing Dt:
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04/13/1995
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Inventors:
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HIROYUKI KURINO, YOICHI MIYAI
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Title:
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METHOD FOR CONCURRENTLY FORMING HOLES FOR INTERCONNECTION BETWEEN DIFFERENT CONDUCTIVE LAYERS AND A SUBSTRATE ELEMENT OR CIRCUIT ELEMENT CLOSE TO THE SUBSTRATE SURFACE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 655474, M/S 219 |
| DALLAS, TEXAS 75265 |
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| WILLIAM W. HOLLOWAY |
| P.O. BOX 655474, M/S 219 |
| DALLAS, TX 75265 |
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