Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/01/1997
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Application #:
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08533118
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Filing Dt:
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09/25/1995
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Inventors:
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RANDY LO, HEM P. TAKIAR
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Title:
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ENCAPSULATION FILLER TECHNOLOGY FOR MOLDING ACTIVE ELECTRONICS COMPONENTS SUCH AS IC CARDS OR PCMCIA CARDS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95052 |
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| STEVE D. BEYER |
| HICKMAN & BEYER |
| P.O. BOX 61059 |
| PALO ALTO, CA 94306 |
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