Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
04/29/1997
|
Application #:
|
08538232
|
Filing Dt:
|
10/03/1995
|
Inventors:
|
MASAYASU KOJIMA, CHIHIRO HAYASHI, TETSUO ABIKO, KEIJI MIKI
|
Title:
|
HEAT SINK FIN ASSEMBLY FOR COOLING AN LSI PACKAGE
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
5-33 KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI |
OSAKA, JAPAN |
|
|
1-10, FUSO-CHO, AMAGASAKI-SHI |
HYOGO-KEN, JAPAN |
|
|
|
PLATON N. MANDROS |
BURNS, DOANE, SWECKER & MATHIS |
P.O. BOX 1404 |
ALEXANDRIA, VA 22313-1404 |
|
|
Search Results as of:
05/04/2024 11:13 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|