Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/29/1997
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Application #:
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08402254
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Filing Dt:
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03/10/1995
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Inventors:
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RICHARD J. HUANG, ROBIN W. CHEUNG
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Title:
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LOW COST SOLUTION TO HIGH ASPECT RATIO CONTACT/VIA ADHESION LAYER APPLICATION FOR DEEP SUB-HALF MICROMETER BACK-END-OF LINE TECHNOLOGY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE AMD PLACE, M/S 68 SUNNYVALE, CALIFORNIA 94088-3453 |
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| BENMAN COLLINS & SAWYER |
| DAVID W. COLLINS |
| 711 WEST LOS ALTOS ROAD |
| TUCSON, ARIZONA 85704-4105 |
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