Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/27/1997
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Application #:
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08537248
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Filing Dt:
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09/29/1995
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Inventor:
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TAKESHI YAMAMOTO
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Title:
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MULTI-CHIP CERAMIC MODULE FOR MOUNTING ELECTRIC PARTS ON BOTH SUBSTRATE AND CAP CONNECTED THROUGH INTERCONNECTING PINS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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7-1 SHIBA 5-CHOME |
MINATO-KU, TOKYO, JAPAN |
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HELFGOTT & KARAS, P.C. |
SAMSON HELFGOTT |
EMPIRE STATE BUILDING, 60TH FLOOR |
NEW YORK, NY 10118 |
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