Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/01/1997
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Application #:
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08600461
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Filing Dt:
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02/13/1996
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Inventor:
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RAVI IYER
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Title:
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ENDPOINT REGULATOR AND METHOD FOR REGULATING A CHANGE IN WAFER THICKNESS IN CHEMICAL-MECHANICAL PLANARIZATION OF SEMICONDUCTOR WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 6 |
| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83707 |
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| SEED AND BERRY LLP |
| PAUL T. PARKER |
| 6300 COLUMBIA CENTER |
| 701 FIFTH AVENUE |
| SEATTLE, WA 98104-7092 |
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