Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/08/1997
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Application #:
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08384506
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Filing Dt:
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02/03/1995
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Inventors:
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ARTHUR M. WILSON, MARK A. KRESSLEY, DEAN L. FREW, JUANITA G. MILLER, JOHN E. HANICAK et al
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Title:
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SOLDER BUMP TRANSFER FOR MICROELECTRONICS PACKAGING AND ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13500 N. EXPRESSWAY, P.O. BOX 655474, M/S 219 |
| DALLAS, TEXAS 75265 |
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| 03RENE E. GROSSMAN |
| P.O. BOX 655474 |
| M/S 219 |
| 13500 NO. CENTRAL EXPRESSWAY |
| DALLAS, TX 75265 |
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