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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/22/1997
Application #:
08499778
Filing Dt:
07/07/1995
Inventors:
AKIRA KOJIMA, TSUNEYUKI HAYASHI, HIROYUKI FUKASAWA, TAKASHI SAITO
Title:
RESIN MOLDING APPARATUS
Assignment: 1
Reel/Frame:
007789/0096Recorded: 01/16/1996Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/14/1995
Exec Dt:
12/04/1995
Exec Dt:
12/18/1995
Exec Dt:
12/19/1995
Assignee:
7-35 KITASHINAGAWA 6-CHOME, SHINAGAWA=K
TOKYO, JAPAN
Correspondent:
HILL, STEADMAN & SIMPSON P.C.
LEWIS T. STEADMAN
233 S. WACKER DRIVE
85TH FLOOR SEARS TOWER
CHICAGO, IL 60606

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