Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/22/1997
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Application #:
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08598958
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Filing Dt:
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02/09/1996
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Inventor:
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KEN-ICHI TOMITA
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH MULTILAYER WIRING STRUCTURE, INCLUDING IMPROVED STEP OF FORMING INSULATING FILM WHICH COVERS WIRING LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 72 HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, JAPAN |
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| FINNEGAN, HENDERSON, FARABOW, ET AL |
| ERNEST F. CHAPMAN |
| 1300 I STREET, N.W. |
| WASHINGTON, D.C. 20005 |
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