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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/22/1997
Application #:
08454324
Filing Dt:
08/10/1995
Inventors:
TADAHIRO OHMI, HISAYUKI SHIMADA, MASAKI HIRAYAMA
Title:
HIGH SPEED SEMICONDUCTOR DEVICE WITH A METALLIC SUBSTRATE
Assignment: 1
Reel/Frame:
007579/0583Recorded: 08/10/1995Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/22/1995
Exec Dt:
06/26/1995
Assignee:
1-17-301, KOMEGABUKURO 2-CHOME, AOBA-KU, SENDAI-SHI
MIYAGI-KEN 980, JAPAN
Correspondent:
JAMES P. ZELLER
MARSHALL, O'TOOLE, GERSTEIN, ET AL
6300 SEARS TOWER
233 SOUTH WACKER DRIVE
CHICAGO, IL 60606-6402
Assignment: 2
Reel/Frame:
017215/0184Recorded: 12/29/2005Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/27/2005
Assignee:
586-9, USHIGAFUCHI AKATSUKA, TSUKUBA-CITY
IBARAKI PREFECTURE, JAPAN 305-0062
Correspondent:
PHILLIP J. ARTICOLA
FOLEY & LARDNER LLP
WASHINGTON HARBOUR
3000 K STREET, N.W., SUITE 500
WASHINGTON, D.C. 20007-5143

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