Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/29/1997
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Application #:
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08494957
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Filing Dt:
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06/26/1995
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Inventors:
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NAOKI UCHIYAMA, MASAYOSHI KOHINATA, AKIHIRO MASUDA, YOSHIAKI OKUHAMA, SEISHI MASAKI et al
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Title:
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ELECTROPLATING SOLUTION FOR FORMING PB-SN ALLOY BUMP ELECTRODES ON SEMICONDUCTOR WAFER SURFACE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 5-1, OHTE-MACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| NO. 1-17, SHIMOSAWA-DORI 2-CHOME, HYOGO-KU |
| KOBE-SHI, KYOGO-KEN, JAPAN |
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| LEONARD HOLTZ |
| FRISHAUF, HOLTZ, GOODMAN, |
| LANGER & CHICK, P.C. |
| 767 THIRD AVENUE, 25TH FLOOR |
| NEW YORK, NY 10017-2023 |
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