Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/26/1997
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Application #:
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08623676
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Filing Dt:
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03/29/1996
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Inventors:
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KENZO ISHIDA, YOHKO MASHIMOTO, KINYA ICHIKAWA
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Title:
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METHOD FOR CONTROLLING SOLDER BUMP HEIGHT AND VOLUME FOR SUBSTRATES CONTAINING BOTH PAD-ON AND PAD-OFF VIA CONTACTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95052 |
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BLAKELY SOKOLOFF TAYLOR & ZAFMAN |
MICHAEL A. BERNADICOU |
12400 WILSHIRE BOULEVARD |
7TH FLOOR |
LOS ANGELES, CA 90025 |
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