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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/30/1997
Application #:
08527835
Filing Dt:
09/13/1995
Inventors:
KIYOSHI ISHII, MIZUHO ISHIKAWA
Title:
DIE ASSEMBLY FOR MOLDING A LEAD SCREW
Assignment: 1
Reel/Frame:
009227/0961Recorded: 06/01/1998Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/09/1998
Assignee:
A CORPORATION OF JAPAN
4106-73 MIYOTA-MACHI
KITASAKU-GUN, NAGANO-KEN, JAPAN
Correspondent:
MARSHALL & MELHORN
PHILLIP S. OBERLIN
FOUR SEAGATE - 8TH FLOOR
TOLEDO, OHIO 43604
Domestic rep:
MARSHALL & MELHORN
PHILLIP S. OBERLIN
FOUR SEAGATE - 8TH FLOOR
TOLEDO, OHIO 43604

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