Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
12/16/1997
|
Application #:
|
08474305
|
Filing Dt:
|
06/07/1995
|
|
Inventors:
|
BRIAN LYNCH, PATRICK O'BRIEN
|
|
Title:
|
PROCESS FOR MANUFACTURING AN INTERCONNECT BUMP FOR FLIP-CHIP INTER- GRATED CIRCUIT INCLUDING INTEGRAL STANDOFF AND HOURGLASS SHAPED SOLDER COATING
|
|
|
Assignment:
1
|
|
|
|
|
|
|
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1621 BARBER LANE |
| MS: D-105 LEGAL |
| MILPITAS, CALIFORNIA 95035 |
|
|
|
|
| LSI CORPORATION |
| 1621 BARBER LANE |
| MS: D-105 LEGAL |
| MILPITAS, CA 95035 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
|
|
|
|
| DARYL K. NEFF |
| LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP |
| 600 SOUTH AVENUE WEST |
| WESTFIELD, NJ 07090 |
|
|
Search Results as of:
05/11/2024 05:35 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
