Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/16/1997
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Application #:
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08606638
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Filing Dt:
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02/26/1996
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Inventor:
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DANIEL T. HURLEY
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Title:
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HIGH SPEED DIAMOND-BASED MACHINING OF SILICON SEMICONDUCTOR DIE IN WAFER AND PACKAGED FORM FOR BACKSIDE EMISSION MICROSCOPE DETECTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 46560 FREMONT BOULEVARD, NBO. 414 |
| FREMONT, CALIFORNIA 94538 |
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| HENRY K. WOODWARD |
| TOWNSEND & TOWNSEND & CREW |
| TWO EMBARCADERO CENTER, 8TH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 1421 CALIFORNIA CIRCLE |
| MILPITAS, CALIFORNIA 95035-3099 |
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| BEYER WEAVER & THOMAS LLP |
| P.O. BOX 70250 |
| OAKLAND, CA 94612-0250 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 45900 NORTHPORT LOOP EAST |
| FREMONT, CALIFORNIA 94538 |
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| NIXON PEABODY LLP |
| 401 NINTH STREET NW, SUITE 900 |
| WASHINGTON, DC 20004 |
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