Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/23/1997
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Application #:
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08688173
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Filing Dt:
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07/29/1996
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Inventors:
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FUMIHIKO HASEGAWA, MAKOTO KOBAYASHI, TAMEYOSHI HIRANO
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS AND PROCESS OF AND APPARATUS FOR GRINDING USED FOR THE SAME METHOD OF MANUFACTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TOGINBIRU, 4-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, 100, JAPAN |
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| EVENSON, MCKEOWN, EDWARDS & LENAHAN |
| J. D. EVANS |
| 1200 G STREET, N.W. |
| SUITE 700 |
| WASHINGTON, DC 20005 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO ADD ADDITIONAL ASSIGNEE TO THE ASSIGNMENT DATA PREVIOUSLY RECORDED AT REEL 8229 FRAME 0710.
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| TOGINBIRU, 4-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO 100, JAPAN |
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| 5-3-38, UJINA-HIGASHI, MINAMI-KU, |
| HIROSHIMA-SHI, HIROSHIMA, JAPAN |
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| EVENSON, MCKEOWN, EDWARDS ET AL. |
| J. D. EVANS |
| 1200 G STREET, NW |
| SUITE 700 |
| WASHINGTON, DC 20005 |
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