Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/06/1998
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Application #:
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08227385
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Filing Dt:
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04/14/1994
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Inventor:
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KENJI TSUKAMOTO
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Title:
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PACKAGING STRUCTURE FOR A HERMETICALLY SEALED FLIP CHIP SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME MINATO-KU |
| TOKYO, JAPAN |
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| J. FRANK OSHA |
| SUGHRUE, MION, ZINN, MACPEAK & SEAS |
| 2100 PENNSYLVANIA AVENUE, N.W., STE. 800 |
| WASHINGTON, DC 20037-3202 |
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