Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/13/1998
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Application #:
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08777495
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Filing Dt:
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12/30/1996
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Inventors:
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TAKAO OCHI, HISASHI FUNAKOSHI, ICHIRO OKUMURA, HAJIME HONMA, KEIJI OKUMA et al
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Title:
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LEAD FRAME AND METHOD OF MOUNTING SEMICONDUCTOR CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SAIWAI-CHO, TAKATSUKI-SHI |
| OSAKA 569, JAPAN |
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| MCDERMOTT, WILL & EMERY |
| ATTN: EDWARD E. KUBASIEWICZ, ESQ. |
| 1850 K STREET, N.W. |
| SUITE 450 |
| WASHINGTON, D.C. 20006-2296 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| NO. 1006 KADOMA |
| KADOMA CITY, OSAKA, JAPAN |
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| SUGHRUE MION, PLLC |
| DAVID J. CUSHING |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, D.C. 20037-3213 |
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