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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/10/1998
Application #:
08759453
Filing Dt:
12/05/1996
Inventor:
HARILAOS MAVRIDIS
Title:
MULTILAYER MODULAR EXTRUSION DIE
Assignment: 1
Reel/Frame:
009289/0113Recorded: 06/22/1998Pages: 17
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/18/1998
Assignee:
C/O MORRISON, COHEN, SINGER & WEINSTEIN
750 LEXINGTON AVENUE
NEW YORK, NEW YORK 10022
Correspondent:
BIEBEL & FRENCH
GILBERT HENDERSON
2500 KETTERING TOWER
DAYTON, OH 45423
Assignment: 2
Reel/Frame:
009267/0767Recorded: 06/22/1998Pages: 11
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/10/1998
Assignee:
405 LEXINGTON AVENUE
NEW YORK, NEW YORK 10174
Correspondent:
BIEBEL & FRENCH
GILBERT HENDERSON
2500 KETTERING TOWER
DAYTON, OHIO 45423

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