Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/17/1998
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Application #:
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08487628
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Filing Dt:
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06/07/1995
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Inventors:
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YASUHIRO HIRANO, MASATSUGU AKIBA, YUTAKA SHIOMI, NORIAKI SAITO
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Title:
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FILLER-CONTAINING RESIN COMPOSITION SUITABLE FOR INJECTION MOLDING AND TRANSFER MOLDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-33, KITAHAMA-4-CHOME, CHUO-KU |
| OSAKA, JAPAN |
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| KENDREW H. COLTON |
| CUSHMAN, DARBY & CUSHMAN |
| 1100 NEW YORK AVENUE, N.W., 9TH FLOOR |
| WASHINGTON, DC 20005-3918 |
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Assignment:
2
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CHANGE OF ASSIGNEE'S CORPORATE ADDRESS.
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| 27-1, SHINKAWA 2-CHOME |
| CHUO-KU, TOKYO, JAPAN |
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| PILLSBURY WINTHROP LLP |
| CAROLINE D. DENNISON |
| 1600 TYSONS BOULEVARD |
| P.O. BOX 10500 |
| MCLEAN, VA 22102 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7TH FLOOR, NO. 301, SONGKIANG ROAD |
| TAIPEI, TAIWAN, CHINA |
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| SAFIYA JARVIS |
| 111 HUNTINGTON AVENUE |
| BOSTON, MA 02199 |
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