Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/24/1998
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Application #:
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08775383
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Filing Dt:
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12/30/1996
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Inventors:
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HIDEO SHIKATA, JUN SAKAI
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Title:
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MANUFACTURING PROCESS OF CONNECTING ROD ASSEMBLY AND COMPACTING DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MATSUDO-SHI |
| 520 MINORIDAI |
| CHIBA-KEN, JAPAN 271 |
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| MCDONNELL BOEHNEN HULBERT & BERGHOFF |
| MICHAEL S. GREENFIELD |
| 300 SOUTH WACKER DRIVE |
| CHICAGO, IL 60606 |
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