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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/31/1998
Application #:
08671310
Filing Dt:
07/01/1996
Inventors:
NAGARAJ P. MITTY, HERBERT E. LECORNU, DEVIPRASAD MALLADI
Title:
HEAT SINK AND FAN FOR COOLING CPU CHIP
Assignment: 1
Reel/Frame:
008066/0101Recorded: 07/01/1996Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/27/1996
Exec Dt:
06/27/1996
Exec Dt:
06/27/1996
Assignee:
2550 GARCIA AVENUE
MOUNTAIN VIEW, CALIFORNIA 94043
Correspondent:
FLEHR, HOHBACH, TEST, ALBRITTON, ET AL.
JULIAN CAPLAN, ESQ.
4 EMBARCADERO CENTER
SUITE 3400
SAN FRANCISCO, CA 94111-4187
Assignment: 2
Reel/Frame:
037254/0771Recorded: 12/09/2015Pages: 11
Conveyance:
MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/12/2010
Exec Dt:
02/12/2010
Newly Merged Entity Data
Exec Dt:
02/12/2010
Newly Merged Entity's New Name:
500 ORACLE PARKWAY
REDWOOD SHORES, CALIFORNIA 94065
Correspondent:
ORACLE CORPORATION
500 ORACLE PARKWAY
ATTN: PTO GROUP (M/S 5OP7)
REDWOOD CITY, CA 94065

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