Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/07/1998
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Application #:
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08873111
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Filing Dt:
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06/11/1997
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Inventor:
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HIROSI KATO
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Title:
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METHOD OF FABRICATING SEMICONDUCTOR DEVICE INCLUDING GOLD INTER- CONNECTIONS WHERE THE GOLD GRAIN SIZE IS A FUNCTION OF THE WIDTH OF THE INTERCONNECTIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753, SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA 211-8666, JAPAN |
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| SUGHRUE MION, PLLC |
| J. FRANK OSHA |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037-3213 |
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