Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/14/1998
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Application #:
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08560280
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Filing Dt:
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11/17/1995
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Inventors:
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SATYA CHILLARA, SHAHRAM MOSTAFAZADEH
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Title:
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HIGH DENSITY INTEGRATED CIRCUIT PACKAGE ASSEMBLY WITH A HEATSINK BETWEEN STACKED DIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| M/S D-3579 |
| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95051 |
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| LIMBACH & LIMBACH |
| MICHAEL J. POLLOCK |
| 2001 FERRY BUILDING |
| SAN FRANCISCO, CALIFORNIA 94111 |
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