Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/21/1998
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Application #:
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08602603
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Filing Dt:
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02/16/1996
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Inventor:
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KENNOSUKE IIDA
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Title:
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METHOD FOR INTRODUCING MOLD MATERIALS INTO A MOLD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 19-5, NIHONBASHI KOAMI-CHO |
| CHUO-KU, TOKYO, JAPAN |
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| 5-4-71, HIGASHI, HANYU-SHI |
| SAITAMA, JAPAN |
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| MORGAN, LEWIS, BOCKIUS LLP |
| ROBERT J. GAYBRICK |
| 1800 M STREET, N.W. |
| WASHINGTON, D.C. 20036 |
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