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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/05/1998
Application #:
08712117
Filing Dt:
09/11/1996
Inventor:
JAE-CHUL RYU
Title:
MULTI-LAYERED CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
008172/0005Recorded: 10/07/1996Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/27/1996
Assignee:
28 SUNGJU-DONG, CHANGWON-CITY
KYONGSANGNAM-DO, KOREA, REPUBLIC OF
Correspondent:
FINNEGAN, HENDERSON, FARABOW, ET AL.
ERNEST F. CHAPMAN
1300 I STREET, N.W.
WASHINGTON, DC 20005-3315
Assignment: 2
Reel/Frame:
033327/0442Recorded: 07/16/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/30/2014
Assignee:
84, JEONGDONG-RO, SEONGSAN-GU,
GYEONGSANGNAM-DO,
CHANGWON-SI, KOREA, REPUBLIC OF 641-120
Correspondent:
SUGHRUE MION
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037

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