Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/12/1998
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Application #:
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08519588
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Filing Dt:
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08/25/1995
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Inventor:
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MASAAKI ISHII
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Title:
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METHOD FOR ENCAPSULATION OF SEMICONDUCTOR DEVICES WITH RESIN AND LEADFRAME THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12, NEGORO MOMOYAMA-CHO, FUSHIMI-KU |
| KYOTO-FU, JAPAN |
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| VENABLE, BAETJER, HOWARD & CIVILETTI |
| JEFFREY L. IHNEN |
| 1201 NEW YORK AVENUE, N.W., SUITE 1000 |
| WASHINGTON, D.C. 20005 |
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