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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/02/1998
Application #:
08733207
Filing Dt:
10/17/1996
Inventors:
KEIICHIRO KATA, SHUICHI MATSUDA, HIRONORI ONO
Title:
METHOD OF MANUFACTURING CHIP-SIZE PACKAGE-TYPE SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
008279/0651Recorded: 10/17/1996Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/14/1996
Exec Dt:
10/14/1996
Exec Dt:
10/14/1996
Assignee:
7-1, SHIBA 5-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
HAYES, SOLOWAY, HENNESSEY ET AL
NORMAN P. SOLOWAY
175 CANAL STREET
MANCHESTER, NEW HAMPSHIRE 03101

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