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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/16/1998
Application #:
08478491
Filing Dt:
06/07/1995
Inventors:
WILLIAM A. LANFORD, WEI WANG, PEIJUN DING
Title:
PASSIVATED COPPER CONDUCTIVE LAYERS FOR MICROELECTRONIC APPLICATIONS AND METHODS OF MANUFACTURING SAME
Assignment: 1
Reel/Frame:
007686/0334Recorded: 10/26/1995Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/17/1995
Exec Dt:
10/17/1995
Exec Dt:
10/14/1995
Assignee:
STATE UNIVERSITY PLAZA
P.O. BOX 9
ALBANY, NEW YORK 12201
Correspondent:
MELISSA B. PENDLETON, ESQ.
BELL, SELTZER, PARK & GIBSON
POST OFFICE DRAWER 34009
CHARLOTTE, NORTH CAROLINA 28234

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