Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/23/1998
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Application #:
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08200432
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Filing Dt:
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02/23/1994
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Inventors:
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YOSHIHIRO MIYAZAWA, YASUNORI OHKUBO
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Title:
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METHOD AND APPARATUS FOR WAFER BONDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-35 KITASHINAGAWA 6-CHOME |
| SHINAGAWA-KU |
| TOKYO, JAPAN |
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| RONALD P. KANANEN |
| MARKS & MURASE |
| 2001 L STREET, NW., STE. 750 |
| WASHINGTON, D.C. 20036 |
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