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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/30/1998
Application #:
08520338
Filing Dt:
08/28/1995
Inventors:
KEIZO KAWAMURA, NORIYUKI ASHIWAKE, TAKAHIRO DAIKOKU, AKIO IDEI, KENICHI KASAI et al
Title:
LOW THERMAL RESISTANT, FLUID-COOLED SEMICONDUCTOR MODULE
Assignment: 1
Reel/Frame:
007928/0515Recorded: 01/29/1996Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/11/1996
Exec Dt:
01/11/1996
Exec Dt:
01/11/1996
Exec Dt:
01/11/1996
Exec Dt:
01/11/1996
Exec Dt:
01/11/1996
Exec Dt:
01/11/1996
Exec Dt:
01/11/1996
Exec Dt:
01/11/1996
Assignee:
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
EVENSON, MCKEOWN, EDWARDS & LENAHAN
JAMES T. MCKEOWN, ESQUIRE
1200 G STREET, N.W., SUITE 700
WASHINGTON, D.C. 20005

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